Modeling for electromagnetic heat coupling analysis in compact RF and digital electronic devices and assemblies

摘要

The rapidly increasing speed and density of RF and digital electronic devices/assemblies has exposed the associated electromagnetic heat coupling challenges. Excessive heat can damage the system since the components parameter values usually vary with temperature. Especially for compact electronic devices, heat dissipation issues post challenges for system performance and even failure. Hence, it is crucial to analyze electromagnetic heat coupling in compact electronic assemblies such as SFP transceivers during design stage. In this paper, the modeling of electromagnetic heat coupling inside a small form-factor pluggable (SFP) optical transceiver assembly including RF and digital components is presented. The simulated results will be useful to define thermal management components for an electronic device design and assembly such as thermal interface material, thermal time constant and thermal resistance of devices.