Method of manufacturing an electronic device assembly having an electromagnetic shield and a heat radiating portion and the electronic device having an electromagnetic shield and a heat radiating portion

摘要

Substrate (120), provided on the (120) substrate at least one electronic component and (171 to 173), sealed portion covering the electronic components of one (171-173) of at least the electronic device, and (140) provided. Electromagnetic protective layer (130), surface (140) and (143), and covering (121,141,122,142) of the side perpendicular to the (143) surface the encapsulation facing the (120) substrate to. In the present invention, the region which is surrounded by a sealed portion of the electronic device (111, 112), electromagnetic protective layer (130) by (134,162 166) electrical connections and / or thermally for (168) I electrically connected to and / or thermally Te. During the manufacture of electronic devices, it is divided from the panel electronic device, to form electromagnetic protective layer (130) followed. [Selection Figure Figure 8A