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The method of manufacturing an electronic device assembly having a heat radiating portion and electromagnetic shielding, and an electronic device having a heat radiating portion and electromagnetic shielding
The method of manufacturing an electronic device assembly having a heat radiating portion and electromagnetic shielding, and an electronic device having a heat radiating portion and electromagnetic shielding
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机译:具有散热部分和电磁屏蔽的电子设备组件的制造方法以及具有散热部分和电磁屏蔽的电子设备
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摘要
Substrate (120), provided on the (120) substrate at least one electronic component and (171 to 173), sealed portion covering the electronic components of one (171-173) of at least the electronic device, and (140) provided. Electromagnetic protective layer (130), surface (140) and (143), and covering (121,141,122,142) of the side perpendicular to the (143) surface the encapsulation facing the (120) substrate to. In the present invention, the region which is surrounded by a sealed portion of the electronic device (111, 112), electromagnetic protective layer (130) by (134,162 166) electrical connections and / or thermally for (168) I electrically connected to and / or thermally Te. During the manufacture of electronic devices, it is divided from the panel electronic device, to form electromagnetic protective layer (130) followed. [Selection Figure Figure 8A
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