A System Power Device Technology Vertically Integrating Magnetic Substrate

摘要

To achieve higher power density and better noise attenuation, a new technology is presented in this paper by vertically integrating a magnetic substrate. A Buck converter is utilized as an example and an organic magnetic substrate is introduced. The power inductor is designed with a substrate and bonded onto the leadframe. The switching regulator IC is bonded on top of the magnetic substrate. The magnetic substrate has multiple magnetic layers to achieve higher inductance density. Its top metal layer is used as an interconnecting distribution layer for the IC and discrete components. The system power device, which integrates switching regulator IC, inductor, input capacitor filter and output capacitor filter into a single TO-263 package, features high power density and excellent low noise injection to the input voltage source and output voltage rail. The on-device input capacitors and output capacitor form a high frequency noise filtering network which can effectively attenuates noises in across a wide frequency range up to giga hertz frequencies. The input voltage noise and output voltage noise comparisons are given in this paper. The efficiency chart is also provided.