首页> 外文会议>IEEE Applied Power Electronics Conference and Exposition >User-Programmable Short-Circuit Capability Enhancement for 1.2 kV Si IGBTs using a 40 V Si Enhancement-Mode MOSFET connected in Series with the Emitter
【24h】

User-Programmable Short-Circuit Capability Enhancement for 1.2 kV Si IGBTs using a 40 V Si Enhancement-Mode MOSFET connected in Series with the Emitter

机译:用户可编程的,使用与发射极串联的40 V Si增强模式MOSFET增强1.2 kV Si IGBT的短路能力

获取原文

摘要

Commercially available Si IGBTs are designed in two forms – i) optimized for low VCE,SAT but with poor SC ruggedness, and ii) optimized to achieve good short-circuit withstand capability but with high VCE,SAT. A new method is proposed to achieve good short circuit withstand capability for IGBTs designed with low VCE,SAT. A user programmable short circuit withstand capability is achieved using a low voltage Si enhancement mode power MOSFET (EMM) connected in series with the emitter. The proposed concept enables the applications engineer to achieve a desired short-circuit withstand time with minimal impact on on-state and switching performance. Experimental demonstration is provided with commercially available 1.2 kV Si IGBTs. A 2.3x improvement in tSC is achieved with a 24% increase in on-state voltage drop and less than 5% increase in switching losses. The proposed concept also provides a sense node at the drain of the EMM which can be used to monitor on-state currents and detect short circuit events.
机译:市售的Si IGBT有两种设计形式:i)针对低VCE,SAT进行了优化,但SC耐用性较差; ii)针对实现良好的短路耐受能力而进行了优化,但具有较高的VCE,SAT。提出了一种新的方法,该方法可为具有低VCE,SAT的IGBT实现良好的短路耐受能力。使用与发射极串联的低压Si增强模式功率MOSFET(EMM),可以实现用户可编程的短路承受能力。所提出的概念使应用工程师能够实现所需的短路耐受时间,并且对导通状态和开关性能​​的影响最小。市场上有售的1.2 kV Si IGBT提供了实验演示。通过将通态压降提高24%,将开关损耗提高不到5%,可以将tSC提升2.3倍。所提出的概念还在EMM的漏极处提供了一个感测节点,该节点可用于监测通态电流并检测短路事件。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号