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Aging-resilient SRAM design: an end-to-end framework

机译:耐老化的SRAM设计:端到端框架

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The performance of transistors degrades due to aging. Bias temperature instability (BTI) is the most prominent aging mechanism in nano-scale CMOS technologies. Aging degradation causes lifetime failures and lowers the quality of shipped chips. We have developed an end-to-end SRAM design framework to maximize the aging resilience under the given constraints. Specifically, we analyze the impact of aging in SRAM peripheral circuits, including address decoder, precharge, write circuit and sense amplifiers (SAs). We explore the efficiency of error-correcting codes (ECC) to combat aging by quantifying the area and delay overheads of ECC and estimating the lifetime yield and DPPM of SRAMs with ECC, respectively. We also calculate the soft error resilience when ECC is used to repair aging failures. After comparing approaches based on cell sizing and ECC in terms of overheads, lifetime yield and DPPM, we can choose either one or a combination of these approaches to identify the optimal design against aging under the given constraints. We integrate our methods into an existing SRAM compiler, CACTI [1], to provide the end-to-end capability to designers.
机译:晶体管的性能由于老化而降低。偏置温度不稳定性(BTI)是纳米级CMOS技术中最突出的老化机制。老化退化会导致使用寿命失败,并降低出厂芯片的质量。我们已经开发了端到端的SRAM设计框架,以在给定的约束下最大化老化弹性。具体来说,我们分析了老化对SRAM外围电路(包括地址解码器,预充电,写电路和读出放大器(SA))的影响。我们通过量化ECC的面积和延迟开销,以及估计带有ECC的SRAM的寿命和DPPM来探索纠错码(ECC)对抗老化的效率。我们还计算了使用ECC修复老化故障时的软错误恢复能力。在根据开销,寿命收益和DPPM对基于单元大小和ECC的方法进行比较之后,我们可以选择这些方法中的一种或组合,以在给定的约束条件下确定针对老化的最佳设计。我们将方法集成到现有的SRAM编译器CACTI [1]中,以为设计人员提供端到端功能。

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