Topology Optimized Fins for a PCM-Based Thermal Management System

摘要

Rapid temperature transients sustained during operation of electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. While Phase Change Materials (PCMs) alone provide little cooling capability, they can be useful as a buffer against these intermittent temperature spikes when used in tandem with conductive and convective cooling. As a PCM undergoes a phase transition, it absorbs or releases large amounts of thermal energy in the form of latent heat while keeping its temperature nearly constant. Depending on PCM material distribution, this energy-storing capability can be leveraged to provide improved electronic cooling performance without significant increases in overall system size or operating costs. This work aims to take advantage of topology optimization to produce highly conductive structures to maximize PCM energy storage, and thus enhance temperature spike mitigation. Computational analysis results indicated moderate improvement over traditional PCM implementation techniques, which center on plate-fin or pin-fin heat sinks.