Multi-port Dynamic Compact Thermal Models of BGA Package using Model Order Reduction and Metaheuristic Optimization

摘要

Thermal behavior of electronic devices can be more and more finely predicted using the latest thermo-fluidic simulation tools. But when realistic three-dimensional geometric descriptions of the device and duty cycle phenomenon need to be analyzed, the parametric calculation times rapidly become unbearable. Numerous model reduction concepts were explored to determine the most efficient ways to report the sensitive temperature of a component, such as DELPHI method. This later promotes the replacement of time-consuming numerical simulations of large detailed model by a simpler multi-port thermal resistances network. The presented work discloses a method, coupling Model-Order-Reduction (MOR) technique and a metaheuristic optimization, allowing to reduce both creation and simulation times of a suitable model of a sophisticated Ball-Grid-Array (BGA) package. The developed reduction process enables generating a Modal Reduced-Order Model (M-ROM) then deriving a practical Dynamic Compact Thermal Models (DCTM), which will be highly reliable whatever the environment conditions. The performances of both deduced models are compared in terms of precision and calculation time with the original three-dimensional model over an extended set of operating conditions scenarios. The final model presents a good agreement, with a discrepancy lower than 2%, while greatly improving simulation speed and optimization run times.