Benchmark Study on Cooling and Reliability Performance Due to Difference in Structure of Power Modules

摘要

In this paper, we describe the features of power modules with different structures, and proposed an efficient design. In detail, the DBC method was used for the substrate, the structure using the grease at the junction of the module and the heat sink, the structure using the solder at the joint part, and the structure using the insulating film on the substrate were analyzed. The authors have been studying thermal evaluation and life evaluation of power modules. We created a model based on it and analyzed it using FEA. Factors of improvement of heat dissipation performance were discussed based on the analysis results. In addition, we investigated the factors for prolonging the fatigue life using Manson coffin law.