A dual-stage algorithm to optimize the thermal placement of the smartphone multiple chips

摘要

The layout has a significant influence to the thermal performance of the smartphone chips. However, it is difficult to optimize the chip layout manually, due to the number of the chips are many and the complexity of the chips’ position constraints. Hence, a novel dual-stage algorithm was proposed in this study. Comparing with an original layout, the optimal chip layout obtains more than 20% improvement in thermal performance. In addition, only less than three hours is needed to finish the optimizing process with the dual-stage algorithm.