Multilayer Thick Printed Copper Structures

摘要

This paper deals with multilayer Thick Printed Copper (TPC) structures on alumina substrates and the testing of their mechanical and electrical properties. Multilayer thick printed copper is a new prospective technology based on sequential printing of copper and dielectric films and their firing in an inert atmosphere. It can be used for power electronics substrate manufacturing. These substrates are used in special applications such as concentrated photovoltaics, smart power modules etc. Adhesion and electrical parameters such as capacity, dielectric constant, resistivity, breakdown voltage, dielectric strength etc. before and after thermal cycling and aging are mentioned in this paper.