36层厚铜不对称结构PCB制作技术

摘要

通讯等设备对电路板的要求，承载网络速度及数据量的增大，迫使线路板的层数与传导能力提升。在生产过程中，多层高厚铜板具有较高的技术要求。本文主要介绍一款36层板的高多层不对称厚铜板的关键制作技术，提供了蚀刻、压合、电镀、钻孔工序的解决方法。%For the requirements of communications equipment PCB, the increase of the speed and volume of data network, the number of layers and the conduction capability of PCB forces upgrading. In the production process, thick copper multilayer PCB have high technical requirements. This paper mainly introduces the key making technology of a 36 thick copper multilayer asymmetric structure PCB, providing a solution for etching, pressing, electroplating, drilling process.