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Improved performance of new fast recovery high voltage diode chip set of 3.3kV and 6.5kV

机译:新型3.3kV和6.5kV快速恢复高压二极管芯片组的性能改进

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In this paper, the development of fast recovery 6.5 and 3.3 kV diode chip integrated in IGBT module is presented. Based on Dynex MAX-SOA technology, the newly developed diode chip set integrated in high power IGBT module exhibits a wider range of reverse recovery safe operating area where conduction and reverse recovery characteristics have been optimized.
机译:本文介绍了集成在IGBT模块中的快速恢复6.5和3.3 kV二极管芯片的开发。基于Dynex MAX-SOA技术,集成在大功率IGBT模块中的新开发的二极管芯片组具有更广泛的反向恢复安全工作区域,其中已优化了传导和反向恢复特性。

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