首页> 外国专利> HIGH VOLTAGE-FAST RECOVERY DIODE (HV-FRD) WITH IMPROVED AVALANCHE RESISTANCE AND MANUFACTURING METHOD THEREOF

HIGH VOLTAGE-FAST RECOVERY DIODE (HV-FRD) WITH IMPROVED AVALANCHE RESISTANCE AND MANUFACTURING METHOD THEREOF

机译:耐雪崩性提高的高压快速恢复二极管(HV-FRD)及其制造方法

摘要

The present invention relates to a structure of a high voltage-fast recovery diode (HV-FRD) with improved avalanche resistance and a manufacturing method thereof. The HV-FRD adopts an embedded plug and a buried blocking layer. Also, unique operation and a unique structure such as bidirectional operation and an alternating plug design are provided. The embedded plug has a large diameter and forms a gentle junction to increase breakdown voltage and at the same time reduce leakage current. The buried blocking layer (BBL), together with the embedded plug (EP), restricts movement of a carrier injected into an active area to increase the level of EAS indicating the avalanche performance. Therefore, the structure of a new element given in the present invention adopts the EP and the BBL to control and restrict conduction such as injection of a carrier, thereby being applicable in manufacturing semiconductor elements such as an HV-FRD having large EAS (avalanche energy), an PIN diode, a Zener diode, and a TVS diode.;COPYRIGHT KIPO 2014
机译:本发明涉及一种耐雪崩性提高的高耐压恢复二极管(HV-FRD)的结构及其制造方法。 HV-FRD采用嵌入式插头和掩埋阻挡层。而且,提供了独特的操作和独特的结构,例如双向操作和交替插头设计。嵌入式插头具有较大的直径,并形成平缓的结,以增加击穿电压,同时减小泄漏电流。掩埋的阻挡层(BBL)与嵌入式插头(EP)一起限制了注入有源区的载流子的运动,从而提高了指示雪崩性能的EAS级别。因此,本发明中给出的新元件的结构采用EP和BBL来控制和限制诸如载流子注入的传导,从而可用于制造具有大EAS(雪崩能量)的HV-FRD之类的半导体元件。 ),PIN二极管,齐纳二极管和TVS二极管。; COPYRIGHT KIPO 2014

著录项

  • 公开/公告号KR20140047404A

    专利类型

  • 公开/公告日2014-04-22

    原文格式PDF

  • 申请/专利权人 SIGETRONICS INC.;

    申请/专利号KR20120113656

  • 发明设计人 SHIM KYU HWAN;CHO DEOK HO;

    申请日2012-10-12

  • 分类号H01L29/861;

  • 国家 KR

  • 入库时间 2022-08-21 15:43:13

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