Thermal conductivity of epoxy resin using molecular dynamics simulation

摘要

The low thermal conductivity of amorphous epoxy resin significantly limits its applications in electronics. In this paper, the thermal conductivity of cross-linked epoxy resin was investigated by Green-Kubo method. A stepwise crosslinking method was adopted to construct the molecular model. In order to verify the correlation lengths effect, four different correlation lengths are considered under the same integral time. The contributions of curing agent types and conversions towards thermal conductivity are discussed.