EPOXY RESIN COMPOSITION CAPABLE OF INCREASING THERMAL CONDUCTIVITY BY USING AN EPOXY RESIN HAVING A MESOGEN STRUCTURE, AND A HEAT RADIANT CIRCUIT BOARD

摘要

PURPOSE: An epoxy resin composition is provided to improve heat conductivity, low absorption, low heat expansion, heat resistance, solubility, and storage stability while having excellent moldability and reliability.;CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a hardener, and an inorganic filler as main components. The epoxy resin comprises a crystalline epoxy resin. The hardener comprises an epoxy binder which is obtained by adding a hardening agent into the crystalline epoxy resin. A heat radiant circuit board(100) comprises a metal plate(110), an insulating layer(120) formed on the metal plate, and a circuit pattern(130) formed on the insulating layer. The insulating layer comprises the circuit pattern. The insulating layer is formed by hardening the epoxy resin composition.;COPYRIGHT KIPO 2013