High thermal conductivity resin compound high thermal conductivity resin molded body-heat dissipation sheet for blending particles, high thermal conductivity resin compound high thermal conductivity resin molded body-heat dissipation sheet, and manufacturing method thereof

摘要

PROBLEM TO BE SOLVED: To provide a highly heat-conductive resin compound capable of producing heat-releasing sheets which can prevent the roughening of surfaces, even when large particles exceeding 80 m are used, hardly drop the particles from cut faces, and furthermore improve heat conductivity, to provide a highly heat-conductive resin molded article, to provide compounding particles for heat-releasing sheets, to provide a highly heat-conductive resin compound, to provide a highly heat-conductive resin molded article, to provide a heat-releasing sheet, and to provide a method for producing the same.;SOLUTION: The highly heat-conductive resin compound, the highly heat-conductive resin molded article, the compounding particles for heat-releasing sheets, the highly heat-conductive resin compound, the highly heat-conductive resin molded article, the heat-releasing sheet, and the method for producing the same, are each characterized by containing 60 to 80 vol.% of spherical alumina particles having an average particle diameter of 80 to 100 m and 20 to 40 vol.% of alumina particles having an average particle diameter of 0.5 to 7 m.;COPYRIGHT: (C)2008,JPO&INPIT