首页> 外文期刊>Plastics news >Flexible,Low Outgassing Epoxy Resin Compound Has High Thermal Conductivity
【24h】

Flexible,Low Outgassing Epoxy Resin Compound Has High Thermal Conductivity

机译:柔性,低释气环氧树脂化合物具有高导热性

获取原文
获取原文并翻译 | 示例
           

摘要

Master Bond Inc.,Hackensack,N.J.has introduced a new high performance bonding,sealing,coating and encapsulation system called EP21TDC-2L0.This formulation offers high flexibility and excellent toughness.It cures at room temperatures or more rapidly at elevated temperatures.It has a 1 to 3 mix ratio by weight or volume and has a working life of 90 minutes for a 100gm.mass.EP21TDC-2L0 is easy to apply.Little exotherm is developed during cure making it suitable for use in thick as well as in thin sectioned configurations.
机译:新泽西州哈肯萨克的Master Bond Inc.公司推出了一种新型的高性能粘结,密封,涂层和包封系统EP21TDC-2L0,该配方具有很高的柔韧性和优异的韧性,可以在室温下或在高温下更快地固化。重量或体积的1-3混合比例,每100克质量的使用寿命为90分钟.EP21TDC-2L0易于施工,固化过程中几乎不放热,适用于厚浆和薄浆分段配置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号