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Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles

机译:燃烧合成的h-BN颗粒填充环氧树脂复合材料的导热系数

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摘要

The thermal conductivity of epoxy resin composites filled with combustion-synthesized hexagonal boron nitride (h-BN) particles was investigated. The mixing of the composite constituents was carried out by either a dry method (involving no use of solvent) for low filler loadings or a solvent method (using acetone as solvent) for higher filler loadings. It was found that surface treatment of the h-BN particles using the silane 3-glycidoxypropyltrimethoxysilane (GPTMS) increases the thermal conductivity of the resultant composites in a lesser amount compared to the values reported by other studies. This was explained by the fact that the combustion synthesized h-BN particles contain less –OH or active sites on the surface, thus adsorbing less amounts of GPTMS. However, the thermal conductivity of the composites filled with the combustion synthesized h-BN was found to be comparable to that with commercially available h-BN reported in other studies. The thermal conductivity of the composites was found to be higher when larger h-BN particles were used. The thermal conductivity was also found to increase with increasing filler content to a maximum and then begin to decrease with further increases in this content. In addition to the effect of higher porosity at higher filler contents, more horizontally oriented h-BN particles formed at higher filler loadings (perhaps due to pressing during formation of the composites) were suggested to be a factor causing this decrease of the thermal conductivity. The measured thermal conductivities were compared to theoretical predictions based on the Nielsen and Lewis theory. The theoretical predictions were found to be lower than the experimental values at low filler contents (< 60 vol %) and became increasing higher than the experimental values at high filler contents (> 60 vol %).
机译:研究了填充燃烧合成的六方氮化硼(h-BN)颗粒的环氧树脂复合材料的导热性。通过干式方法(不使用溶剂)以降低填料用量,或以溶剂法(使用丙酮作为溶剂)以提高填料用量来进行复合成分的混合。已经发现,与其他研究报道的值相比,使用硅烷3-环氧丙氧基丙基三甲氧基硅烷(GPTMS)对h-BN颗粒进行表面处理可以使所得复合材料的导热系数降低。这可以通过以下事实来解释:燃烧合成的h-BN颗粒在表面上包含较少的-OH或活性位点,因此吸附的GPTMS较少。然而,发现填充有燃烧合成的h-BN的复合材料的热导率与其他研究报道的可商购h-BN的热导率相当。当使用较大的h-BN颗粒时,发现复合材料的导热系数更高。还发现热导率随着填料含量的增加而增加,达到最大值,然后随着该含量的进一步增加而开始下降。除了在较高的填料含量下具有较高的孔隙率的影响之外,还提出了在较高的填料载荷下形成的更多水平取向的h-BN颗粒(可能是由于复合材料成型过程中的压制)是导致导热系数降低的一个因素。将测得的热导率与基于尼尔森和刘易斯理论的理论预测进行比较。发现理论预测值低于在低填料含量(<60 vol%)下的实验值,并且变得比在高填料含量(> 60 vol%)下的实验值更高。

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