Research on Large Area Soldering Process for Microwave RF Module Based on DOE Method

摘要

The soldering layer between PCB and the substrate is a main way of heat dissipation and ground connection for microwave RF module. Therefore, the void rate of soldering layer, which means the quality of soldering, has a direct relation with the performance and reliability of the RF module. The mechanism of void forming and theoretical ways to decrease the void rate is analyzed. Using DOE method, the effects of solder shape, soldering technique, substrate coating material and fixing way of PCB on the void rate of soldering layer were studied, and then the main factors influencing the void rate were given.