An electronic module having an oxide surface finish as a solder mask and method of manufacturing an electronic module using organic solder resist and oxide surface processing operation

摘要

An electronic module includes a substrate, conductive pads on upper and lower surfaces of the substrate, at least one electronic component disposed on the upper surface of the substrate and soldered to the pads on the upper surface of the substrate, a molding compound containing the at least one covering an electronic component and a solder resist comprising an organometallic compound at areas between corresponding ones of the pads on the lower surface of the substrate. The module is fabricated using both an OSP surfacing process to coat the pads on the top surface of the substrate with OSP to protect the pads from oxidation while the electronic component is bonded to the substrate and an oxide surface processing operation to form the solder resist ,