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Parasitic resistance modeling and optimization for 10nm-node FinFET

机译:10nm节点FinFET的寄生电阻建模和优化

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A TCAD-based study on the parasitic resistance (Rparasitics) of 10nm FinFET is performed. A total parasitic resistance of 1490Q/Fin is extracted using calibrated physical models, and the components of the Rparasitics are evaluated. It is observed that by introducing wraparound contact and highly doped source/drain, contact resistance (Rcontact) of 10nm FinFET is well minimized and current crowding in the fin is suppressed. It is also found that the resistance of the lightly doped spacer region (Rspacer) constitutes more than 50% of total Rparasitics and can be optimized by introducing highly doped segments. With the optimized doping profile in the spacer, drain current (Id) and intrinsic gain (Av) can be improved by 11% and 16%, respectively. In the case for 7nm-node FinFET, it was concluded that further Rcontact reduction is also needed to optimize its performance.
机译:进行了基于TCAD的10nm FinFET寄生电阻(R parasitics )的研究。使用校准后的物理模型提取总寄生电阻1490Q / Fin,并评估R 寄生物的成分。观察到,通过引入环绕接触和高掺杂的源极/漏极,可以很好地最小化10nm FinFET的接触电阻(R contact ),并且可以抑制鳍中的电流拥挤。还发现轻掺杂间隔区(R spacer )的电阻占总R 寄生的50%以上,并且可以通过引入高掺杂段来优化。利用隔离器中的优化掺杂曲线,漏极电流(Id)和本征增益(Av)可以分别提高11%和16%。对于7nm节点FinFET,可以得出结论,还需要进一步减少R contact 以优化其性能。

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