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CMOS-compatible contact technology for Si photonics

机译:CMOS兼容的硅光子接触技术

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In this paper, we present a short overview of the CMOS-compatible contact technology developed in our group on n-InP and p-InGaAs for Si photonic applications. Obtained results cover a wide spectrum: from surface preparation and solid-state reaction to electrical results and laser integration. The metallurgy of several systems including Ni / InGaAs, Ni / InP, Ti / InGaAs and Ti / InP has been studied. Most of the metallizations studied provide efficient solutions for contacting n-InP and p-InGaAs. Finally, guidelines for integrating low resistivity contacts are proposed.
机译:在本文中,我们简要概述了我们小组在用于Si光子应用的n-InP和p-InGaAs上开发的CMOS兼容接触技术。获得的结果涵盖了广泛的范围:从表面处理和固态反应到电学结果和激光积分。研究了包括Ni / InGaAs,Ni / InP,Ti / InGaAs和Ti / InP在内的几种系统的冶金学。研究的大多数金属镀层为接触n-InP和p-InGaAs提供了有效的解决方案。最后,提出了集成低电阻率触点的指南。

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