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CMOS-compatible contact technology for Si photonics

机译:Si Photonics的CMOS兼容接触技术

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In this paper, we present a short overview of the CMOS-compatible contact technology developed in our group on n-InP and p-InGaAs for Si photonic applications. Obtained results cover a wide spectrum: from surface preparation and solid-state reaction to electrical results and laser integration. The metallurgy of several systems including Ni / InGaAs, Ni / InP, Ti / InGaAs and Ti / InP has been studied. Most of the metallizations studied provide efficient solutions for contacting n-InP and p-InGaAs. Finally, guidelines for integrating low resistivity contacts are proposed.
机译:在本文中,我们概述了我们在N-InP和P-InGaAs上开发的CMOS兼容的联系技术的简短概述,用于SI光子应用。得到的结果涵盖了宽频谱:从表面制备和固态反应到电气效果和激光整合。研究了几种系统的冶金,包括Ni / IngaAs,Ni / InP,Ti / IngaAs和Ti / InP。研究的大多数金属化提供了接触N-InP和P-Ingaas的有效解决方案。最后,提出了用于集成低电阻率接触的指导。

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