Thermal Performance Comparison of Advanced 3D Packaging Concepts for Logic and Memory Integration in Mobile Cooling Conditions

摘要

In this paper, we present the assessment of the thermal performance of four different 3D packaging concepts for the integration of logic and memory in a generic 5” mobile device: package-on-package (PoP), 3D stacked die in BGA package, Si interposer in BGA package and a reconstructed wafer level chip scale package (RWL-CSP) interposer. The thermal performance is compared using an experimentally validated conduction model. The simulation study for the evaluation of different system level cooling solutions for all four packages show that spreading the heat close to the heat source (in the package) is more efficient than the system level spreading.