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Current filament monitoring under unclamped inductive switching conditions on real IGBT interconnection

机译:在实际的IGBT互连中,在未钳位的感应开关条件下监控电流灯丝

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Destruction under unclamped inductive switching is typical, catastrophic destruction phenomena. We used our original printed circuit board Rogowski sensor and monitored current filaments in IGBT under unclamped inductive switching conditions at emitter pads of IGBT devices. The current filament varied a little by switching condition. Even with the same switching condition, the current varied a little from sample to sample. Temperature and photoemission monitoring was sufficient to analyse a major current filament under unclamped inductive switching condition from the standpoint of time resolution. The spatial resolution of current monitoring should be improved to monitor minor phenomena of current filaments.
机译:在未钳位的感应开关下的破坏是典型的灾难性破坏现象。我们使用了原始的印刷电路板Rogowski传感器,并在未钳位的电感开关条件下,在IGBT器件的发射极上监控了IGBT中的电流丝。电流灯丝因开关条件而略有变化。即使在相同的开关条件下,样品之间的电流也会略有不同。从时间分辨率的角度来看,温度和光发射监视足以分析未钳位的感应开关条件下的主电流灯丝。电流监测的空间分辨率应提高,以监测电流灯丝的微小现象。

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