首页> 外文会议>Annual Device Research Conference >Self-aligned ZnO thin-film transistors with 860 MHz fT and 2 GHz fmax for large-area applications
【24h】

Self-aligned ZnO thin-film transistors with 860 MHz fT and 2 GHz fmax for large-area applications

机译:具有860 MHz fT和2 GHz fmax的自对准ZnO薄膜晶体管,适用于大面积应用

获取原文

摘要

High-frequency thin film transistors (TFTs) enable many important thin film circuits used in flexible large-area systems such as large bandwidth instrumentation amplifiers (related to f) and high-frequency oscillators (related to f) [1,2]. In [3] f=10GHz and f=2.9GHz were reported but using Si substrates and pulsed laser deposition for ZnO growth, which are incompatible with low-cost large-area processing on a meter scale. More modest reports of f=1GHz with sputtered IGZO on glass have relied on a very sensitive alignment process, impractical for fabrication over large substrates [4]. In this work we present a ZnO-channel TFT process fully compatible with flexible large-area substrates. We achieve an f=2GHz and f=860MHz by reducing source/drain (S/D) to gate overlaps (X) and scaling channel lengths down to 500nm via a self-aligned process.
机译:高频薄膜晶体管(TFT)使得许多重要的薄膜电路可用于柔性大面积系统,例如大带宽仪表放大器(与f有关)和高频振荡器(与f有关)[1,2]。在[3]中报道了f = 10GHz和f = 2.9GHz,但是使用Si衬底和脉冲激光沉积进行ZnO生长,这与以米为单位的低成本大面积加工不兼容。关于在玻璃上溅射IGZO的f = 1GHz的更为适度的报道依赖于非常灵敏的对准过程,这对于在大型基板上制造是不切实际的[4]。在这项工作中,我们提出了与柔性大面积基板完全兼容的ZnO沟道TFT工艺。通过减少源极/漏极(S / D)到栅极重叠(X)并通过自对准过程将沟道长度缩小到500nm,我们实现了f = 2GHz和f = 860MHz。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号