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A Post-Silicon Trace Analysis Approach for System-on-Chip Protocol Debug

机译:片上系统协议调试的后硅跟踪分析方法

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Reconstructing system-level behavior from silicon traces is a critical problem in post-silicon validation of System-on-Chip designs. Current industrial practice in this area is primarily manual, depending on collaborative insights of the architects, designers, and validators. This paper presents a trace analysis approach that exploits architectural models of system-level protocols to reconstruct design behavior from partially observed silicon traces in the presence of ambiguous and noisy data. The output of the approach is a set of all potential interpretations of a system's internal execution abstracted to system-level protocols. To support the trace analysis approach, a companion trace signal selection framework guided by system-level protocols is also presented, and its impacts on the complexity and accuracy of the analysis approach are discussed. That approach and the framework have been evaluated on a multi-core System-on-Chip prototype that implements a set of common industrial system-level protocols.
机译:从芯片走线重构系统级行为是片上系统设计的芯片后验证中的关键问题。该领域的当前工业实践主要是手动的,具体取决于建筑师,设计师和验证者的协作见解。本文提出了一种痕迹分析方法,该方法利用系统级协议的体系结构模型在存在歧义和嘈杂数据的情况下,从部分观察到的硅迹线中重建设计行为。该方法的输出是对系统内部执行的所有潜在解释的集合,这些解释被抽象为系统级协议。为了支持跟踪分析方法,还提出了一种以系统级协议为指导的伴随跟踪信号选择框架,并讨论了其对分析方法的复杂性和准确性的影响。该方法和框架已在多核片上系统原型上进行了评估,该原型实现了一组常见的工业系统级协议。

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