Dual lobe shading of surface copper voids in copper metal lines: YE: Yield enhancement/learning

摘要

Copper voids are critical defect issues in the metal lines. Massive voids cause functional fails and the smaller ones that do not cause any function fails carry high risk of failing later in life. They are threats to product lifetimes. In this work, we discuss a process for dual damascene copper for metal lines capable of causing surface voids.