Development of ultra-thin MEMS micro mirror device

摘要

We have developed an ultra-thin micro electromechanical systems (MEMS) mirror. The thickness of the device is 5.31 μm including Si structures and actuators. It was fabricated on a silicon-on-insulator wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO layers were deposited. It was easily bonded on a flexible polyimide substrate and wired using adhesive and conductive pastes, without changing the conventional fabrication and bonding technology. The ultra-thin MEMS mirror can be actuated on the flexible substrate. Specifically, it rotated 3.58 degrees with a 1-V applied voltage at a resonant frequency of 10400 Hz.