A systematic experimental investigation of thermal degradation mechanisms in lidded flip-chip packages: Effects of thermal aging and cyclic loading

摘要

This research effort is geared towards establishing a robust virtual-qualification methodology for thermal performance of flip-chip packages. In the experimental analysis presented here, test vehicles were designed and tested for degradation in the module-level thermal interface material under high temperature storage (at 100C, 125C and 150C) exposure and deep thermal cycling (-40C/+125C) conditions. The experiments conducted in this study will encompass a wide range of thermo-mechanical conditions that not only explore known JEDEC variables but also provide unique insights into understanding the effects of indirect thermal degradation drivers such as package assembly loads and chipjunction temperature variations during thermal power inputs during readouts.