Optical Setup for Solar Wafer Edge Chip Inspection

摘要

Limitations of typical camera orientations used to image solar wafer edge chipping by existing systems are demonstrated. A new design with multi-angle light source and a camera set-up which would enable the top surface and the side of a wafer to be viewed simultaneously is proposed. The capability of the new design is demonstrated and it was found that the proposed set-up is able to overcome existing limitations and obtain images that show good contrast between the defective area and its background. This would simplify the requirements for image processing for automated detection systems.