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Tin plating investigation as a potential alternate to silver plating in plug in connection for low voltage low amp miniature circuit breakers

机译:低压低安小型断路器的插头连接中镀锡的研究有可能替代镀银

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This paper reports the investigation of tin plating as a potential alternate to silver plating on plug in line terminal connections for low voltage low amp miniature circuit breakers. The plug in line terminals are typically connected on the enclosure interior bus bars and clamped with a spring clip. The substrate material of the line terminal was a copper alloy. The line terminals with both, tin and silver plating, were investigated on tin plated aluminum and bare copper bus bars. The connections were examined by cycling 50 Amps ac, one hour on and one hour off for 2,100 cycles in an ambient temperature of 25°C. The examined parameters were bulk temperature and voltage drop. SEM observations have been made for both, tin and silver plating, after the current cycling. Additionally, the plating deterioration on the contact spots was measured for oxygen and copper contents by EDX analysis. The analysis results indicated much higher contents of oxygen and copper on the tin plated connectors than the silver plated connectors which is consistent with the connector plating deterioration and fretting that was observed with the SEM.
机译:本文报告了对低压低电流微型断路器的插入式接线端子连接上的镀锡替代镀银的一种潜在研究。插入式线路端子通常连接在机柜内部汇流条上,并用弹簧夹夹紧。线路端子的基板材料是铜合金。在镀锡的铝和裸铜母线上研究了镀锡和镀银的线路端子。通过在25°C的环境温度下循环50安培交流电,开启1小时和关闭1小时,进行2,100个循环,以检查连接情况。检查的参数是整体温度和电压降。在当前循环之后,对镀锡和镀银均进行了SEM观察。另外,通过EDX分析测量了接触点上的镀层劣化的氧和铜含量。分析结果表明,镀锡连接器上的氧和铜含量比镀银连接器高得多,这与用SEM观察到的连接器镀层劣化和微动现象是一致的。

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