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Auger method to characterize metal oxides on titanium tungsten barrier layer for copper pad

机译:俄歇方法表征铜垫钛钨阻挡层上的金属氧化物

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Titanium-tungsten (TiW) barrier layers were treated with process chemicals like palladium sulfate (PdSO4), diluted hydrofluoric acid (DHF), O2 plasma etc and the metal oxides change post treatments were investigated. The changes of metal oxides on surface and inside the TiW layer were characterized with Auger surface scan and depth profiling. The dominant species were identified as tungsten oxide (W-O) and copper oxide (Cu-O). Qualitative chart featuring atomic peak intensity (%) in response to the thickness (min) were plotted to show the trends of both W-O and Cu-O across the samples treated with different conditions. DHF can etch away Cu-O but at the same time enhanced W-O. Cu-O was enhanced under slow wet/dried condition at ambient air and by O2 plasma while W-O is not affected in both conditions.
机译:钛-钨(TiW)阻挡层用诸如硫酸钯(PdSO4),稀氢氟酸(DHF),O2等离子体等工艺化学品处理,并研究了后处理过程中金属氧化物的变化。通过俄歇表面扫描和深度剖析表征了TiW层表面和内部的金属氧化物的变化。确定的主要物质为氧化钨(W-O)和氧化铜(Cu-O)。绘制了以原子峰强度(%)对厚度(min)的响应为特征的定性图,以显示在不同条件下处理的样品中W-O和Cu-O的趋势。 DHF可以蚀刻掉Cu-O,但同时可以增强W-O。 Cu-O在慢湿/干燥条件下,环境空气中和O2等离子体下得到增强,而W-O在两种条件下均不受影响。

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