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Preparation and Characterization of Room Temperature Operating NO_2 Gas Sensor Based on Intermediate-sized Porous Silicon Modified with WO_3 Thin Films

机译:基于中尺寸多孔硅的室温操作No_2气体传感器的制备与表征,用WO_3薄膜改性

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In this paper, intermediate-sized porous silicon (PS) sensing material was prepared via galvanostatic electrochemical anodization technique in a Teflon double-tank cell configuration. Then, tungsten oxide (WO_3) thin films were deposited onto the PS surface by using DC reactive magnetron sputtering method. The morphology of PS and WO3/PS were observed by field emission scanning electron microscope (FESEM), respectively. Subsequently, the NO_2-sensing performances of PS and WO_3/PS sensors were studied at room temperature (RT, 25°C) up to 100°C. The results indicated both sensors had the same optimal operating temperature of RT. Moreover, it is found that pure PS showed a typical n-type semiconductor behavior. However, after depositing the WO_3 thin films, the WO_3/PS behaved as a p-type semiconductor.
机译:在本文中,通过在Teflon双罐电池构造中通过镀锌电化学阳极氧化技术制备中间尺寸的多孔硅(PS)感测材料。然后,通过使用DC反应性磁控溅射方法将氧化钨(WO_3)薄膜沉积到PS表面上。通过现场发射扫描电子显微镜(FESEM)观察PS和WO3 / PS的形态。随后,在室温(RT,25℃)至100℃的室温(RT,25℃)中,研究了PS和WO_3 / PS传感器的NO_2感测性能。结果表明,两个传感器的RT的最佳工作温度相同。此外,发现纯PS显示出典型的n型半导体行为。然而,在沉积WO_3薄膜之后,WO_3 / PS表现为p型半导体。

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