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Analysis of decline of silicon-aluminum alloy cavity air tightness

机译:硅铝合金腔气密性下降的分析

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In this paper, based on the results of SEM and EDS analysis, there are two main reasons for Silicon-aluminum alloy cavity leakage. First, silicon-aluminum alloy material is unqualified; second, it produces cracks and pores during laser welding defects. In the test, silicon-aluminum alloy material is manufactured by powder metallurgy. It is pressure-type is not dense. In the uneven distribution of silicon particles can appear stress concentration, and the substrate itself do not close with the combination of silicon, in the material porosity increased, there may be no or only a few of the aluminum substrate distribution, but also for aluminum ductility is better than silicon ductility, lead to formation and extension of cracks. It is difficult to meet the electronic packaging air tightness. In the process of laser welding, the water on the surface of aluminum silicon alloy or not removed the film decompose to produce hydrogen under the instantaneous heat input of laser. Due to the hydrogen solubility in the solid and liquid aluminum vary widely, when laser welding molten pool start cooling, hydrogen solubility in the aluminum decrescent fast and hydrogen precipitate. Along the edge of the fusion many porosity, crack, and a certain extent coarsening the weld microstructure, which lead to a fall in the microwave cavity air tightness.
机译:本文基于SEM和EDS分析的结果,硅铝合金腔体泄漏有两个主要原因。首先,硅铝合金材料不合格;第二,在激光焊接缺陷时会产生裂纹和气孔。在测试中,硅铝合金材料是通过粉末冶金制造的。它是压力型的,不致密。在硅颗粒的不均匀分布中会出现应力集中,并且基体本身与硅的结合不紧密,在材料孔隙率增加时,可能没有或只有少量的铝基体分布,而且对于铝的延展性优于硅的延展性,导致裂纹的形成和扩展。很难满足电子包装的气密性。在激光焊接的过程中,在激光瞬时热输入下,铝硅合金表面或未被去除的膜上的水分解而产生氢。由于氢在固态铝和液态铝中的溶解度差异很大,当激光焊接熔池开始冷却时,铝中的氢溶解度快速下降,氢沉淀。沿着熔合的边缘,许多孔隙,裂纹和一定程度的粗化焊缝组织,导致微波腔的气密性下降。

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