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Rack Thermal Model Prediction Accuracy Improvement by Utilizing Rack Power Consumption as Modelling Feature

机译:机架热模型通过利用机架功耗作为建模特征来预测准确性改进

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In this paper, importance of rack power consumption as modelling feature of data center thermal model is studied. Data center thermal model is utilized to predict rack inlet and outlet temperature distribution in order to control air conditioner operational parameters such as supply/return air temperature, air conditioner indoor unit fan speed etc. Experimental data collection has been performed at a data center in Southern India, consisting of 18 racks and 3 air conditioners. Rack temperature (inlet and outlet at top and middle position), rack power consumption and air conditioner return air temperature data was collected over 4 days. Return air temperature of air conditioner was varied at steps of 21°C, 23°C and 25°C on each day and total rack power consumption was found to be varying between 37.6 kW to 42.2 kW. Thermal model utilizing rack power consumption and air conditioner return air temperature as modelling features can predict rack inlet and outlet temperature with 0.64°C RMS error, showing an improvement of 26.4% over thermal model without rack power consumption and air conditioner return air temperature only as modelling feature. Also, error range reduces to 1.8°C, showing an improvement of 33.3%.
机译:本文研究了作为数据中心热模型的建模特征的机架功耗的重要性。数据中心热模型用于预测机架入口和出口温度分布,以控制空调操作参数,例如供应/返回空气温度,空调室内机风扇速度等。实验数据收集已经在南部的数据中心进行印度,由18架和3个空调组成。机架温度(顶部和中间位置的入口),收集机架功耗和空调返回空气温度数据超过4天内收集。空调的返回空气温度以21℃,23℃和25°C的步长而变化,每天23°C和25°C,发现总架功耗在37.6kW至42.2 kW之间变化。热模型利用机架功耗和空调返回空气温度作为建模特征可以预测0.64°C rms误差的齿条入口和出口温度,显示出在没有机架功耗的热模型上的26.4%,空调仅作为空调返回空气温度建模功能。此外,误差范围减少到1.8°C,显示出33.3%的提高。

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