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Influence of LT-AlN buffer layers on density of threading dislocation in AlGaN layers

机译:LT-ALN缓冲层对AlGAN层中线脱位密度的影响

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To assess the influence of low temperature (LT) AlN buffer layers on the density of threading dislocations, we deposited multilayer structures consisting of AlN and AlGaN using metal organic chemical vapor deposition. We used two types of composite substrate in this study: (1) ELOG GaN/sapphire, and (2) sapphire. The resulting multilayer structures were examined in cross section by transmission electron microscopy. We show that the deposition of low temperature AlN buffer on highly perfect ELOG GaN leads to defective AlN/GaN interfaces. Some of the dislocations associated with these interfaces evolve into threading dislocations in AlGaN layers. We also demonstrate that multilayer of AlN buffers are only moderately effective in reducing the density of TDs into overgrown AlGaN layers.
机译:为了评估低温(LT)ALN缓冲层对螺纹脱位密度的影响,我们使用金属有机化学气相沉积沉积由ALN和AlGa组成的多层结构。 我们在本研究中使用了两种类型的复合衬底:(1)Elog GaN / Sapphire,和(2)蓝宝石。 通过透射电子显微镜检查所得到的多层结构。 我们表明,在高度完美的Elog GaN上沉积低温ALN缓冲液导致ALN / GAN接口有缺陷。 与这些界面相关的一些脱位在AlGaN层中的螺纹脱位中成交。 我们还证明了ALN缓冲液的多层仅适度地减少了将TDS的密度降至过度的AlGaN层中。

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