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Normally-off AlGaN/GaN recessed MOS-HEMTs on normally-on epitaxial structures for microwave power applications

机译:常开外延结构上的常关AlGaN / GaN凹陷MOS-HEMT,适用于微波功率应用

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This paper presents the realization and characterization of normally-off recessed MOS-HEMTs on a Ka-band-dedicated AlGaN/GaN epitaxial structure. Previous HEMTs results on this structure feature an output power of 3.5 W/mm with PAE of 39 % at 30 GHz CW. Normally-off operation was achieved through the use of gate recess combined with a Al2O3 gate oxide, by a fabrication process compatible with that of normallyon high-frequency power HEMTs. Electrical performances include threshold voltage over 1 V, pulsed drain current in excess of 400 mA/mm and fmax of 35 GHz. Dynamic Ron transients after switching events were investigated, showing thermally-activated increase of Ron over 10 decades of time. Low-frequency output-admittance measurements were also conducted to evaluate the impact of gate recess etching on charge trapping behavior.
机译:本文介绍了在Ka带专用AlGaN / GaN外延结构上常关凹槽MOS-HEMT的实现和特性。在此结构上,以前的HEMT结果表明,在30 GHz CW下,输出功率为3.5 W / mm,PAE为39%。通过使用与Al2O3栅极氧化物相结合的栅极凹槽,通过与通常在高频功率HEMT上兼容的制造工艺,可以实现常关操作。电气性能包括1 V以上的阈值电压,超过400 mA / mm的脉冲漏极电流和35 GHz的fmax。研究了开关事件后的动态Ron瞬变,显示了在10年的时间内Ron的热激活增加。还进行了低频输出导纳测量,以评估栅极凹槽蚀刻对电荷俘获行为的影响。

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