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Impact of scaling channel length on the performances of nanoscale FETs

机译:缩放沟道长度对纳米级FET性能的影响

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The investigation of short-channel effects (SCE) due to channel length reduction for four different types of n-channel FETs: Bulk MOSFET, SOI MOSFET, DG MOSFET and CNTFET are carried out in this work. Simulators are used to investigate SCEs like threshold voltage (Vth) roll-off, subthreshold Swing (SS) and Ion/Ioff ratio. Our study shows that DG MOSFET, SOI MOSFET and Bulk MOSFET reach their scalable limit at 30 nm, 50 nm and 100 nm channel length respectively due to elevation of leakage power consumption as they exhibit rapid degradation of Vth, SS beyond 100mV/decade and less Ion/Ioff ratio. On the contrary, CNTFET can be scaled down below 10 nm as it shows negligible SCEs with stable Vth, ideal SS (60mV/decade) and high Ion/Ioff ratio as channel length decreases. Our numerical analysis shows CNTFET creates only 1.11% Vth variation whereas DG MOSFET creates 39.33% Vth variation. CNTFETs advantages over MOSFET make it viable for faster and enhanced applications in nanoelectronics.
机译:在这项工作中,对四种不同类型的n沟道FET:体MOSFET,SOI MOSFET,DG MOSFET和CNTFET的由于沟道长度减小而导致的短沟道效应(SCE)进行了研究。模拟器用于研究SCE,例如阈值电压(Vth)下降,亚阈值摆幅(SS)和Ion / Ioff比。我们的研究表明,由于漏电功耗升高,DG MOSFET,SOI MOSFET和Bulk MOSFET分别在30 nm,50 nm和100 nm沟道长度上达到了可扩展的极限,因为它们的Vth,SS迅速下降,超过100mV / decade甚至更低。离子/离子流量比。相反,CNTFET可以缩小至10 nm以下,因为随着沟道长度的减小,SFET具有稳定的Vth,理想的SS(60mV / decade)和高的Ion / Ioff比,可以忽略不计。我们的数值分析显示,CNTFET仅产生1.11%的Vth变化,而DG MOSFET产生39.33%的Vth变化。 CNTFET相对于MOSFET的优势使其可用于纳米电子学中的更快和增强的应用。

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