A novel leadframe based power module concept with double sided cooling (DSC) is presented. The DSC module is attached to pin fin coolers using epoxy based insulation sheets. Three different insulation sheets are evaluated. The material analysis of the insulation sheets reveals that alumina particles enhance the thermal performance of the epoxy material significantly. The thermal simulations show that the presented power module offers a lower thermal resistance from chip to coolant of 0.116 K/W than a commercial ceramic based DSC power module. One prototype leadframe power module is set up and characterized to validate the thermal simulation results.
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机译：提出了一种新颖的基于引线框架的电源模块概念，具有双面冷却（DSC）。 DSC模块使用基于环氧树脂的绝缘片连接到销鳍冷却器。评估三个不同的绝缘片。绝缘板的材料分析表明氧化铝颗粒显着增强了环氧材料的热性能。热模拟表明，所示的电源模块提供从芯片到0.116 k / w的冷却剂的较低的热阻，而不是商业陶瓷的基于陶瓷的DSC电源模块。设置一个原型引线框架电源模块并表征以验证热仿真结果。
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