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Gate Oxide TDDB Evaluation System for SiC Power Devices under Switching Operation Conditions

机译:切换操作条件下SiC电源装置的栅极氧化物TDDB评估系统

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This paper proposes a gate-oxide Time-Dependent Dielectric Breakdown (TDDB) evaluation system for SiC power devices under switching operation conditions. A constant voltage High-Temperature Gate Bias (HTGB) test is often used for long-term reliability test of the gate-oxide TDDB of power devices. However, the test condition is different from an actual operation condition. In this paper, a TDDB evaluation circuit that can perform the gate-oxide HTGB test under the operating conditions of the power conversion circuit is described. Using the proposed test circuit, the TDDB evaluation of 1.2 kV Silicon Carbide (SiC) Metal-Oxide-Semiconductor-Field-Effect Transistors (MOSFETs) under switching conditions were performed.
机译:本文提出了在切换操作条件下的SiC电源装置的栅氧化物时间依赖性介电击穿(TDDB)评估系统。恒定电压高温栅极偏压(HTGB)测试通常用于功率器件的氧化栅极TDDB的长期可靠性测试。但是,测试条件与实际操作条件不同。在本文中,描述了在电力转换电路的操作条件下可以执行栅极氧化物HTGB测试的TDDB评估电路。使用所提出的测试电路,执行1.2kV碳化硅(SiC)金属氧化物 - 半导体 - 场效应晶体管(MOSFET)的TDDB评估在切换条件下进行。

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