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P-type doping of MoS2 with phosphorus using a plasma immersion ion implantation (PIII) process

机译:使用等离子体浸没离子注入(PIII)工艺对MoS 2 进行P型掺杂

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A controllable and area selective doping process, especially for p-type Molybdenum disulphide (MoS), is essential for the realization of various p junction-based devices. In this work, we demonstrate p-type doping of multilayer MoS with phosphorus (P) as a dopant using a CMOS-compatible plasma immersion ion implantation (PIII) technique. Detailed physical characterization including XPS and SIMS, backed with ab-initio DFT calculations, confirms p-type doping in P-implanted MoS that could be due to a combination of surface charge transfer from physisorbed phosphine ions and/or substitutional phosphorus present in the top few (∼5) layers. Controlled reduction in current levels and positive V shifts were observed in channel-doped MoS transistors. Further, selectively doped gated p-junction diodes (rectification ∼50X) have been demonstrated.
机译:对于各种基于p / n结的器件的实现,可控的区域选择性掺杂工艺(尤其是p型二硫化钼(MoS))是必不可少的。在这项工作中,我们使用CMOS兼容的等离子浸没离子注入(PIII)技术演示了以磷(P)作为掺杂剂的多层MoS的p型掺杂。由Abs-initio DFT计算支持的详细物理特性(包括XPS和SIMS)证实,P注入的MoS中的p型掺杂可能是由于顶部吸附的物理吸附的膦离子和/或替代磷引起的表面电荷转移的结合几(〜5)层。在掺杂沟道的MoS晶体管中观察到电流水平的受控降低和正V偏移。此外,已经证明了选择性掺杂的栅p / n结二极管(整流〜50X)。

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