A Dual-Output 550 GHz frequency tripler featuring ultra-compact silicon micromachining packaging and enhanced power-handling capabilities

摘要

We report on an ultra-compact 550 GHz Schottky diode based frequency tripler based on an on-chip power combined structure that allows to integrate and combine four multiplying structures onto a single chip to increase up to a factor of four the power handling capabilities of traditional frequency multipliers. The chip is mounted onto a Silicon micromachined stack to increase compactness. The design features to very well balance independent outputs that can be used to feed multi-pixel receivers with no additional power dividing. The tripler is designed to operate in the 520???600 GHz band, showing a measured peak power of 1.6???1.8 mW per output when pumped with 200 mW. This corresponds to an efficiency of around 4% in the device once the output power is corrected for the text fixture losses and other unexpected losses.