Shear strength function of temperature for lead/lead-free alloys samples obtained with different cooling rate

摘要

Usually, the experiments concerning solder joints mechanical stress resistance are shear tests types that offer shear forces (SF) values for solder joints corresponding to surface mounted resistors (SMR) having different case types, but revealing the absence of reference values concerning Lead/Lead-Free solder alloys (L/LFSA) especially for samples having the same geometry as the SMR, being result of real soldering process. In the paper are presented the experiments designed in order to obtain reference values of shear forces (RVSF) for the solder alloys samples having the same transversal section as resistor 1206 case type, assembled in vapour phase soldering (VPS) processes characterized by different values of the cooling rate, for different body temperatures according to the homologous temperatures (HT) concept. The experiments results consisting in qualitative and quantitative analyses and references values of Lead/Lead-Free solder alloys SF, offering in the same time a data base useful in some solder alloys design and their qualification process (QP) into domains exempted by RoHS 2 EU Directive.