首页> 外文会议>Chinese Control and Decision Conference >Influence of thermal and flow distribution for the Czochralski growth process of Si under external magnetic field
【24h】

Influence of thermal and flow distribution for the Czochralski growth process of Si under external magnetic field

机译:外磁场下热流分布对硅直拉晶体生长过程的影响

获取原文

摘要

This paper presents the mathematical models of the melt flow and the thermal transfer during the Czochralski crystal growth with an external magnetic field. The thermal and the flow distribution of silicon crystal growth under vertical magnetic field, transverse magnetic field and Cusp magnetic field were studied respectively using two-dimensional axisymmetric model and three-dimensional local model. The numerical simulation experiment was done using TD — 120 type single crystal furnace parameters. The results showed that the improvements of the thermal and the flow distribution of the silicon melt are limited because of the direction of vertical magnetic field and transverse magnetic field is uniform. The Cusp magnetic field can improve the thermal and the flow distribution effectively, boost the thermal stability of the melt zone, suppress impurity content, and improve the crystal quality.
机译:本文介绍了在外部磁场作用下切克劳斯基(Czochralski)晶体生长过程中熔体流动和热传递的数学模型。利用二维轴对称模型和三维局部模型分别研究了垂直磁场,横向磁场和Cusp磁场下硅晶体生长的热流分布。使用TD_120型单晶炉参数进行了数值模拟实验。结果表明,由于垂直磁场方向和横向磁场方向均匀,硅熔体的热分布和流动分布的改善受到限制。 Cusp磁场可以有效地改善热量和流动分布,提高熔体区的热稳定性,抑制杂质含量,并改善晶体质量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号