Design and simulation of CCGA AlN ceramic package

摘要

With the trend of IC packages toward high frequency, large power and minimization, it becomes more and more important to guarantee the packages' good electrical performance and excellent thermal characteristics. For some CCGA packages, which can be strict in electrical, thermal and size, the traditional AlO ceramic added with heat sink package can't meet the electrical, thermal and size need at the same time. In this paper, for a given die, we firstly designed a CCGA package which has 376 I/O (256 in the outer with 1.27 mm pitch, 120 in the inner with 1.0 mm pitch) in package design software with AlN material, and then simulated the lumped resistance, inductance, capacitance, return loss and insertion loss of a differential signal pair in EM simulation software, respectively. Lastly, we simulated the thermal distribution and thermal resistance difference of the AlO ceramic added with heat sink package and AlN ceramic without heat sink package in thermal simulation software. The simulation results show that the AlN ceramic package has good electrical performance and excellent thermal characteristics. Meanwhile, it not only achieves the minimization but also lightens package weight, also more reliability, satisfies the factual application.