METALLIZING AGENT FOR ALN CERAMIC ELECTRONIC PACKAGE

摘要

PURPOSE: To achieve hermetic seal in an electronic assembly unit by including at least one type of conductive hermetic path on which high-density aluminum nitride ceramic and a specified metal are metallized. ;CONSTITUTION: A compounding ingredient for metallizing a conductive path contains a mixture of aluminum nitride and a metal. The metal is selected from a group containing tungsten, molybdenum and their mixture. The paste of compounding ingredient for metallizing a conductive path, preferably further contains a 'medium' comprised of a binder, a dispersing agent and a solvent. A conductive path hole is formed in each of several aluminum nitride substrate tapes. Conductive path holes are filled with the paste. The tapes are laminated in such a way that the conductive path holes are interconnected vertically. The laminate is baked to make the aluminum nitride tapes and the metallizing agent high in density. The binding is clean combustible under a reducing environmental condition.;COPYRIGHT: (C)1993,JPO