Integrated circuits and systems for THz interconnect

摘要

THz Interconnect holds the potentials to solve long-standing interconnect issues by leveraging the advantages of both electronics and optics sides due to its unique spectrum position. To support ever-increasing interconnect bandwidth requirement, THz interconnect bandwidth density, energy efficiency, and cost effectiveness need to boost and scale with demands. To achieve that, integrated circuits based on mainstream standard processes are preferred. However, the THz circuit design on mainstream silicon processes impose challenges due to their large parasitics and losses, as well as layout dependent device parameters. This paper presents a design methodology to create layout-aware scalable device model to overcome these challenges and demonstrate it in two circuit design examples.