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A systematic study of LPCVD refractory metal/silicide interconnect materials for very large scale integrated circuits

机译：用于大型集成电路的LPCVD难熔金属/硅化物互连材料的系统研究

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作者
Nowrozi, Mojtaba Faiz;
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作者单位

The University of Arizona;

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授予单位 The University of Arizona;
学科
学位 Ph.D.
年度 1988
页码 179 p.
总页数 179
原文格式 PDF
正文语种 eng
中图分类
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专利

1. Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design [J] . Jindal Pardeep Kumar, Sandha Karmjit Singh Journal of Nanoelectronics and Optoelectronics . 2019 ,第9期

机译：混合MWCNTB的热敏意识式建模与性能分析为纳米电子集成电路设计的大规模集成互连材料
2. Development of Materials and New Methods of Forming of Defectless and Corrosion Resistant Metallization of the Large-Scale Integrated Circuits [J] . S.P.Novosyadly Металлофизка　и　новейшие　технологии(на укр., рус. и анг. языках) . 2000 ,第1期

机译：大规模集成电路的缺陷和耐腐蚀金属化材料的研制和新方法
3. Development of Materials and New Methods of Forming of Defectless and Corrosion Resistant Metallization of the Large-Scale Integrated Circuits [J] . S.P.Novosyadly Металлофизка　и　новейшие　технологии(на укр., рус. и анг. языках) . 2000 ,第1期

机译：大规模集成电路的缺陷和耐腐蚀金属化材料的研制和新方法
4. Interconnects on integrated circuits improved by excimer laser planarization for multilevel metallization [C] . Mukai, R., Kobayashi, . 1988

机译：准分子激光平坦化技术用于多层金属化，改善了集成电路上的互连
5. Diffusion studies of metallizations for contacts and interconnects in microelectronics: Platinum silicide and copper. [D] . Shepard, Carlton Lewis. 1993

机译：微电子学中用于接触和互连的金属化的扩散研究：硅化铂和铜。
6. Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects [O] . Hocheon Yoo, Hongkeun Park, Seunghyun Yoo, -1

机译：具有无通孔多层金属互连的高度堆叠3D有机集成电路
7. A systematic study of LPCVD refractory metal/silicide interconnect materials for very large scale integrated circuits. [O] . Nowrozi Mojtaba Faiz. 1988

机译：对用于大规模集成电路的LPCVD难熔金属/硅化物互连材料的系统研究。
8. Refractory Metals and Silicides for Very Large Scale Integration Applications [R] . Saraswat, K. C. 1985

机译：用于超大规模集成应用的难熔金属和硅化物

A systematic study of LPCVD refractory metal/silicide interconnect materials for very large scale integrated circuits

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